AgCu72-28 (wire)
 | Solder grade: AgCu72-28 Application: production of electrovacuum devices. In comparison with Ag72, AgCu72-28 solder contains higher purity charge materials. Properties: Reference density of 10.0 g/cm3. Melting point of 779 ℃ (crystallization interval not more than of 7 ℃). Regulatory document: company standard STO 00195200-048-2018 |
Dimensions:
Minimum diameter, mm | Maximum diameter, mm |
0.15 | 6.00 |
According to the current standard, solder wire is delivered in hard (unannealed) state.
Upon agreement with the customer, solder wire can be supplied in soft (annealed) state.