Planar sputtering targets
Applications: for magnetron sputtering, incl. for coating low-E float glass Regulatory document: technical specifications TU 1995-475-00195200-2006 * * Upon agreement, sputtering targets can be made of other alloys and in accordance with customer’s drawings |
Materials and dimensions:
Material | Grain size, min, mm | Thickness, mm | Width, mm | Length, mm | |||
---|---|---|---|---|---|---|---|
Min | Max | Min | Max | Min | Max | ||
Silver | 0.08 | 0.1 | 35 | 10 | 350 | 10 | 650 |
Gold | 20 | ||||||
Gold-copper | |||||||
Iridium | 200 | 300 | |||||
Palladium | 0.05 | 10 | 300 | 650 | |||
Platinum | |||||||
Rhodium | 3 | 200 | 300 | ||||
** All dimensions are specified for one segment (non-jointed product). Sputtering targets can be made longer and wider by jointing individual elements (segments) |
For further details, please contact us.
To place an order, kindly provide information as below:
Category | Product | Required information | Order quantity |
Technical products | Other technical products | 1. Alloy, contents of major alloy components; 2. Product number or product drawing. 3. Unit pricing (per 1 gram of alloy/per piece; counting per piece) | Required quantity, unit of measurement |